Because of the increasing miniaturization of electronic components, the problem of local heat dissipation continues to grow – cooling options with conventional materials such as copper or silicon
carbide (SiC) are reaching their limits. Diamond has a thermal conductivity of approximately 2000 W/mK, which is the highest of all known materials and more than six-fold that of copper. Diamond
crystals thus represent an interesting option for effectively cooling micro-processors and high-frequency transistors as well as laser sources and optical systems.
Heat spreading with diamond requires new methods that allow the diamond cooling element to be brought directly to the heat source. Here, wafer bonding is the technology of choice and allows the production of any desired diamond hetero-structure. Diacara can support you in the practical implementation of your production process.